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Starblaze has obtained A+ round financing

Release time: 2018-11-23 source:beat365体育官网平台

On August 28, 2018, Starblaze announced to complete the a-plus round of financing at the level of RMB 100 million after the a-round financing of RMB 100 million in 2016. This round of financing was led by shenzhen venture capital group, co-invested by zhongguancun development group, zhonghai development and delong capital. The completion of the new round of financing, Starblaze will speed up the pace of deep cultivation in the industry!

 

The global semiconductor industry will usher in the Chinese era in 2018. The global semiconductor r&d, manufacturing and consumption center, gradually completed the transfer to China. We have seen a slowdown in the development of traditional computing technologies, as well as storage-related technologies, whether data density, power consumption or transmission bandwidth, that continue or exceed Moore's law targets in a short time. This is the era of big data. The rapid explosion of data has put forward urgent demands for a series of industries such as storage medium, storage management and storage service, and storage makes big data more valuable. This is an Internet era of all things, in the next generation of semiconductor memory technology, AI, Internet of things, and with an unstoppable trend ground, 5 g era coming, technical requirements and new technology mature together during this time, since this will be von - Newman architecture, promote the ICT industry revolutionary change of the optimal timing of history.

 

Starblaze was founded in November 2015, is committed to the master control chip research and development of high performance SSD first domestic start-up companies, the company has always been with world-class chip as the goal, and solutions to domestic independent master, power information security as own duty, launched in 2017 high performance consumer SSD STAR1000 master control chip, success won the world first-class module manufacturers order goods and quantity of output in 2018; The second-generation SSD master control STAR1000P was released at the global flash memory summit held in August 2018 in silicon valley, the United States. The goal is to provide customers with the industry's highest performance and lowest power consumption master control chip.

 

The path to the storage

Starblaze was established in November 2015, and completed prototype chip MB1000 streamer in TSMC28nm HPC process in July 2016, and finished mass production chip STAR1000 streamer in March 2017. STAR1000 is a high-end consumer and entry-level enterprise SSD controller with ultra-high performance and extremely low power consumption. It supports pci-e 3.0 x4 channel and NVMe 1.2 protocol. On security, ASE256, SHA256, and TCG OPAL are supported, as well as hardware TRNG. At present, the first model of jianxing's product T10 Plus is equipped with the SSD of STAR000, which is mainly controlled by yixin technology. It is equipped with the Toshiba 64-layer stacking 3D flash memory BiCS3 particles and supports the m. 2 2280 disk type. It has the capacity of 256GB, 512GB and 1TB. At the same time, the star1000-based firmware solution developed by yixin technology independently has been mass produced and started to win continuous orders from industrial customers. Starblaze released the second-generation PCIe SSD master STAR1000P in August 2018, with the sequential reading and writing speed up to 3500/3000mb /s, the largest random reading and writing IOPS is 600K/600K, and is jointly developing the SSD product based on STAR1000P with its partners, which will fully enter the high-performance consumption level, low-power enterprise level and PC/ electronic OEM market.

 

It is committed to providing customers with one-stop storage master control chips and solutions from consumption level to enterprise level, from end to cloud, from storage to data center, and using chip capabilities to accelerate the application and implementation of monitoring and intelligent storage.

 

Looking ahead to the company's product planning in the next few years, CEO sky said that after the launch of STAR1000P in 2018, a series of "Uranus" chips will be launched in 2019, which supports up to 128TB of storage capacity and up to millions of concurrent visits to enter the data center and monitoring fields. Sirius chips will be introduced in 2020 to enter emerging markets for smart storage by importing operating systems, greater computing power and deep learning. The Orion series of chips, a fully integrated chip for storage, computing and networking, will be rolled out in 2021 to help transform storage from traditional storage disks to storage servers serving evolving data centers. Through this series of products, Starblaze will finally realize its "China heart, world dream"